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Telit Wireless Solutions HE910 - Recommended Footprint for HE910 Application

Telit Wireless Solutions HE910
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HE910 Hardware User Guide
1VV0300925 Rev. 32 Page 93 of 111 2019-11-25
Recommended foot print for the application
TOP VIEW
Figure 15-3 Foot print
In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm
placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a
mechanical part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see
figure above) must be clear from signal or ground paths.

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