Telit Wireless Solutions HE910 - Stencil Recommendations for HE910 Assembly; PCB Pad Design Recommendations for HE910

HE910 Hardware User Guide
1VV0300925 Rev. 32 Page 94 of 111 2019-11-25
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Figure 15-4 PCB
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)