HE910 Hardware User Guide
1VV0300925 Rev. 32 Page 97 of 111 2019-11-25
Solder paste
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
15.7.1. HE910 Solder reflow
Recommended solder reflow profile:
Figure 15-7 HE910 Solder reflow
Warning – The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall
system taking into account such factors as thermal mass and warpage.
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