Telit Wireless Solutions HE910 User Manual

HE910 Hardware User Guide
1VV0300925 Rev. 32 Page 97 of 111 2019-11-25
Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
15.7.1. HE910 Solder reflow
Recommended solder reflow profile:
Figure 15-7 HE910 Solder reflow
Warning – The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall
system taking into account such factors as thermal mass and warpage.

Telit Wireless Solutions HE910 Specifications

General

Manufacturer	Telit Wireless Solutions
Model	HE910
Operating Temperature	-40°C to +85°C
Voice Support	Yes
GPS	Yes
Form Factor	LGA
Technology	HSPA+
Frequency Bands	850/900/1800/1900 MHz
Data Rate (Downlink)	Up to 21 Mbps (HSPA+)
Data Rate (Uplink)	Up to 5.76 Mbps (HSPA+)
Interface	UART, USB 2.0, GPIO, I2C, SPI
Certifications	CE, FCC, GCF, PTCRB, IC
Data Rates	HSPA+: Up to 21 Mbps downlink, 5.76 Mbps uplink