WE866E4-P Module Hardware User Guide
1VV0301487 Rev. 1.2 6 2018-07-27
PRELIMINAR
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6.4 Wi-Fi Antenna Requirements ................................................................................................27
6.4.1 PCB Design Guidelines ................................................................................................28
6.4.2 PCB Guidelines in case of FCC Certification ...............................................................29
6.5 BlueTooth Antenna Requirements ........................................................................................29
6.5.1 PCB Design Guidelines ................................................................................................29
6.5.2 PCB Guidelines in case of FCC Certification ...............................................................29
Chapter 7 Audio Section .................................................................................................................. 31
7.1 Electrical Characteristics .......................................................................................................31
7.2 Codec Examples ...................................................................................................................31
Chapter 8 Mechanical Design .......................................................................................................... 33
8.1 Drawing .................................................................................................................................33
Chapter 9 Application PCB Design. ................................................................................................. 35
9.1 Footprint ................................................................................................................................35
9.2 PCB Pad Design ....................................................................................................................37
9.3 PCB Pad Dimension ..............................................................................................................38
9.3.1 Recommendations for PCB Pad Surface .....................................................................39
9.4 Stencil ....................................................................................................................................39
9.5 Solder Paste ..........................................................................................................................39
9.6 Solder Re-flow .......................................................................................................................39
Chapter 10 Packaging ..................................................................................................................... 43
10.1 Tray .....................................................................................................................................43
10.2 Reel .....................................................................................................................................44
10.3 Moisture Sensitivity ..............................................................................................................46
Chapter 11 Conformity Assessment Issue ...................................................................................... 47
11.1 FCC/IC Regulatory Notice ...................................................................................................47
Chapter 12 Safety Recommendation ............................................................................................... 49
12.1 Read Carefully .....................................................................................................................49
Chapter 13 Acronyms ...................................................................................................................... 51
Document History 53
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