Telit Wireless Solutions WE866E4-P - Application PCB Design Guidelines; Module Footprint

WE866E4-P Module Hardware User Guide
1VV0301487 Rev. 1.2 35 2018-07-27
PRELIMINAR
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Chapter 9 Application PCB Design.
• Footprint, page 35
• PCB Pad Design, page 37
• PCB Pad Dimension, page 38
• Stencil, page 39
• Solder Paste, page 39
• Solder Re-flow, page 39
9.1 Footprint
Figure 5, page 35 shows the top view Footprint of copper pad pattern.
Figure 5 Copper pad Pattern - Top View