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Release Notes History
101
SWRU271H–October 2010–Revised April 2019
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Copyright © 2010–2019, Texas Instruments Incorporated
General Information
• The stack now supports up to 3 simultaneous connection as a central / master device, with a few
constraints:
– All connection intervals must be a multiple of the minimum connection interval (i.e. the minimum
connection interval is the greatest common denominator of all connection intervals).
– The minimum connection interval allowed is 25ms when using more than one connection.
– When more than one connection is active, only one data packet per connection event will be
allowed in each direction.
– Scanning is not supported while in a connection. The consequences of this is that device discovery
is not possible while in a connection. Therefore, to discover and connect to multiple devices, the
device discovery must occur before the first connection is established.
• Several new sample projects are included, with examples of many different Bluetooth Low Energy
applications / profiles. Full details on the sample applications can be found in the Bluetooth Low
Energy Sample Applications Guide, which can be accessed from the Windows Start Menu. These
sample applications implement various functions. Some are based on adopted Bluetooth
specifications, some are based on draft specifications, and others are custom designed by Texas
Instruments. These projects should serve as good examples for various other Bluetooth Low Energy
applications.
• The following updates have been made to BTool (more information on these updates can be found in
the CC2540DK-MINI User Guide which can be downloaded here: SWRU270):
– Improved GUI and robustness.
– All functions on the GUI been updated to handle multiple simultaneous connections.
– A new "Pairing / Bonding" tab has been added, allowing link encryption and authentication, passkey
entry, and saving / loading of long-term key data (from bonding) to file.
– Ability to "Cancel" a link establishment while the dongle is initiating.
• The following additional new controller stack features are included in this release:
– Support for multiple simultaneous connections as a master (details above)
– HCI Vendor Specific function HCI_EXT_SetSCACmd allows you to specify the exact sleep clock
accuracy as any value from 0 to 500 PPM, in order to support any crystal accuracy with optimal
power consumption. This feature is only available for slave / peripheral applications.
– HCI Vendor Specific function HCI_EXT_SetMaxDtmTxPowerCmd allows you to set the maximum
transmit output power for Direct Test Mode. This allows you to perform use the LE Transmitter Test
command with power levels less than +4dBm.
– A master device can now advertise while in a connection.
– New production test mode (PTM) has been added allowing the CC2540 to run Direct Test Mode
(DTM) while connected to a tester using a "single-chip" Bluetooth Low Energy library.
– The controller now uses DMA to more efficiently encrypt and decrypt packets. All Bluetooth Low
Energy projects must now define HAL_AES_DMA=TRUE in the preprocessor settings when using
the v1.1 libraries.
• The following additional new host stack features are included in this release:
– A new GAP central role profile for single-chip embedded central applications is included, with
functions similar to the GAP peripheral role profile. The SimpleBLECentral project serves as an
example of an application making use of the central role profile.
– The GAP peripheral role has been optimized to significantly improve power consumption while
advertising with small amounts of data by no longer transmitting non-significant bytes from in the
advertisement and scan response data.
• The following additional new application / profile features are included in this release:
– The GAP peripheral bond manager has been replaced with a general GAP bond manager, capable
of managing bond data for both peripheral and central role devices. The gap peripheral bond
manager has been included for legacy support; however it is recommend to switch to the general
GAP bond manager (gapbondmgr.c/h).
– The bond manager also now manages the storage of client characteristic configurations for each
bond as per the Bluetooth 4.0 spec.
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