Release Notes History
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SWRU271H–October 2010–Revised April 2019
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Copyright © 2010–2019, Texas Instruments Incorporated
General Information
• Fixed CC254x unresponsive when resetting in initiating state
• Fix for after successful reconnect using private non-resolvable address, rebond fails with "Key Req
Rejected"
• Fix for CC254x host Bond Manager setParam configuration does not support M/S LinkKey enc
exchange
• Fixed TICKSPD, CLKSPD is overwritten on X/HS-OSC change
• Fixed Device Fails to Return to Sleep After Last Bluetooth Low Energy Task
Known Issues:
• Use of the NV memory (to save application data or Bluetooth Low Energy Host bonding information)
during a Bluetooth Low Energy connection may cause an unexpected disconnect. The likelihood of this
happening increases with frequent usage, especially when using short connection intervals. The cause
is related to the NV wear algorithm which at some point may cause an NV page erase which can
disrupt system real-time processing. TI recommends using the NV memory sparingly or only when a
connection is not active.
• HCI packet size of 128 bytes or more will be disregarded by the stack and no HCI event will be
returned.
For technical support, visit the Texas Instruments Bluetooth Low Energy E2E Forum:
http://www.ti.com/ble-forum
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Texas Instruments, Inc.
CC2540/41 Bluetooth Low Energy Software Development Kit Release Notes
Version 1.4.0 November 8, 2013
Notices:
• This version of the Texas Instruments Bluetooth Low Energy stack and software is a minor update to
the v1.3.2 release. It contains some minor bug fixes and a few functional changes.
• The Bluetooth Low Energy protocol stack, including both the controller and host, was completely
retested for v1.4.0.
Changes and Enhancements:
• All projects have been migrated from IAR v8.10.4 to IAR 8.20.2.To build all projects, upgrade to IAR
v8.20.2.
• Updated SPI and UART_DMA drivers for improved robustness and throughput.
• Added an overlapped processing feature to improve throughput and reduce power consumption in
devices where peak power consumption isn't an issue. Overlapped processing allows the stack to
concurrently process while the radio is active. Since the stack is concurrently processing, it is able to
insert new data in the Tx buffer during the connection event, causing additional packets to be sent
before the end of the event.
• Added a Number of Completed Packets HCI command which offers the possibility of waiting for a
certain number of completed packets before reporting to the host. This allows higher throughput when
used with overlapped processing.
• Added an HCI Extension command HCI_EXT_DelaySleepCmd which provides the user control of the
system initialization sleep delay (wake time from PM3/boot before going back to sleep). The default
sleep delay is based on the reference design 32 kHz XOSC stabilization time.
• Added a low duty cycle directed advertising option.
• Added support for deleting a single bond with the GAP_BondSetParam command.
• Decreased CRC calculation time during OAD by using DMA.
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