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Release Notes History
95
SWRU271H–October 2010–Revised April 2019
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Copyright © 2010–2019, Texas Instruments Incorporated
General Information
• A new HCI extension API has been added to allow the application layer to get or set a build revision
number.
Bug Fixes:
• In some cases L2CAP Peripheral Connection Parameter Update requests failed due to a zero value in
the transmitWindowOffset parameter when the connection was initially established. This has been fixed
and updates should now work successfully.
• During bonding, connection failures would occasionally occur due to the OSAL Simple NV driver
performing a page compaction and halting the CPU for longer than the time required for the link layer
to maintain proper connection timing. To prevent this from occurring, the simple NV driver now has any
API to force a page compaction if the page is full beyond a specified threshold. The bond manager
calls this API every time a connection is terminated to ensure that compaction occurs before the next
connection is set up.
• Occasional slave connection failures would previously occur in cases in which the master device sends
Update Channel Map requests while a large slave latency value is in use. This has been fixed.
• The SensorTag application now properly supports storage of GATT Client Characteristic Configuration
Descriptor values with bonded devices.
• After disabling advertising, the CC254x would unnecessarily wake up for a short period of time 500ms
later. This unecessary wake-up has been removed.
• Upon Power-On Reset or after wake-up from PM3, a 400ms delay has been implemented, during
which time the CC254x will not go into PM2 sleep. This allows time for the 32kHz crystal to stabilize.
Previously, in rare cases with certain hardware configurations the CC254x could have timing issues
due to the crystal not having time to stabilize.
• Minor bug fixes to GlucoseSensor and GlucoseCollector projects.
Known Issues:
• Use of the NV memory (to save application data or Bluetooth Low Energy Host bonding information)
during a Bluetooth Low Energy connection may cause an unexpected disconnect. The likelihood of this
happening increases with frequent usage, especially when using short connection intervals. The cause
is related to the NV wear algorithm which at some point may cause an NV page erase which can
disrupt system real-time processing. It is therefore recommended that the NV memory be used
sparingly, or only when a connection is not active.
• HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will
be returned.
• The HAL SPI driver that was implemented since the v1.3 release can sometimes hang, particularly in
cases in which power management is used and when there is heavy traffic on the SPI bus.
For technical support, visit the Texas Instruments Bluetooth Low Energy E2E Forum:
http://e2e.ti.com/support/low_power_rf/f/538.aspx
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Version 1.3 Dec 12, 2012
Notices:
• This version of the Texas Instruments Bluetooth Low Energy stack and software features several
changes, enhancements, and bug fixes from v1.2.1. Details of these can be found below.
Changes and Enhancements:
• A new sample project, SensorTag, has been added. This application runs on the CC2541 Sensor Tag
board, which is included as part of the CC2541DK-SENSOR development kit. The application includes
custom services for an accelerometer, barometer, gyro, humidity sensor, IR temperature sensor, and
magnetometer.
• A new Boot Image Manager (BIM) is included. This allows one CC2540 or CC2541 device to contain
two separate software images (an "A" image and a "B" image) stored in flash. Upon power-up, the BIM
selects which image to boot into. This can be based on criteria such as the state of a GPIO pin, or
based on a selection from the previously running application upon reset.
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