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Toshiba TOSDIC-CIE DS Hardware Operation Manual

Toshiba TOSDIC-CIE DS
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3. Installation and wiring
17
Airflow
The loop system components release heat by natural convection. Therefore, no forced cooling
is required for each base unit or module.
However, to keep the ambient temperature within the operating conditions, an exhaust fan is
normally required in the storage housing. Determine the air volume of the fan required for
cooling based on the total heat generated from the individual modules.
Precautions on mounting and wiring
CAUTION
Place the input-output signal lines away from the power line or equipment
generating magnetic and electric fields.
Otherwise, malfunction or failure of the device may occur due to noise.
Do not drop, bump, or apply strong shock to the module.
Failure may occur.
When performing installation or wiring of the loop system components, note the following.
z The loop system components are not dust-proof. Store them in a dust-proof housing
whenever possible.
z Do not install them directly above equipment with a high heating value (heater,
transformer, high-capacity resistor, etc.).
z Do not install them in the same housing as high-voltage equipment.
z Place them away from the high-voltage lines and power transmission lines.
z For safety of maintenance and operation, place them away from high-voltage equipment
and power equipment as much as possible, or provide shielding and separation using iron
plates.
Wiring of the serial bus cable
There are weak signals in the serial bus cable (shielded twisted pair cable). Wiring routes are
shown below in the order of desirability. Use (1) Dedicated route for the serial bus whenever
possible.
(1) Use a dedicated route for the serial bus.
(2) Use a dedicated route for the system.
(3) Use a route for general instrument.
(4) Use a shielded duct.
Table 3.1 shows the specifications of the shielded twisted pair cable.

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Toshiba TOSDIC-CIE DS Specifications

General IconGeneral
BrandToshiba
ModelTOSDIC-CIE DS
CategoryControl Systems
LanguageEnglish

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