u-blox MAX-7 Series - Page 6

MAX-7 / NEO-7 / LEA-7 - Hardware Integration Manual
GPS.G7-HW-11006-1 Contents
Page 6 of 55
3.3.4 General design recommendations: ..................................................................................................................................... 24
3.3.5 Antenna micro strip ........................................................................................................................................................... 25
3.4 Antenna and Antenna supervision .......................................................................................................................................... 26
3.4.1 Antenna design with passive antenna ................................................................................................................................. 26
3.4.2 Active antenna design not using antenna supervisor (NEO-7N, NEO-7M, MAX-7C, MAX-7Q) ............................................... 27
3.4.3 Antenna design with active antenna using antenna supervisor (LEA-7N, MAX-7W) .............................................................. 28
3.4.4 Design with GLONASS / GPS active antenna ....................................................................................................................... 33
3.4.5 Design with GLONASS / GPS passive antenna ..................................................................................................................... 34
3.5 Recommended parts .............................................................................................................................................................. 35
3.5.1 Recommended GPS & GLONASS active antenna (A1) .......................................................................................................... 36
3.5.2 Recommended GPS & GLONASS passive patch antenna ...................................................................................................... 36
3.5.3 Recommended GPS & GLONASS passive chip antenna ........................................................................................................ 36
4 Migration to u-blox-7 modules ................................................................................. 37
4.1 Migrating u-blox 6 designs to a u-blox 7 module ..................................................................................................................... 37
4.2 Hardware migration ............................................................................................................................................................... 38
4.2.1 Hardware compatibility: ..................................................................................................................................................... 38
4.2.2 Hardware migration NEO-6 -> NEO-7 ................................................................................................................................. 39
4.2.3 Hardware migration MAX-6 -> MAX-7 ............................................................................................................................... 40
4.2.4 Hardware migration LEA-6N -> LEA-7N .............................................................................................................................. 41
4.3 Software migration ................................................................................................................................................................ 42
4.3.1 Software compatibility ....................................................................................................................................................... 42
4.3.2 Messages no longer supported ........................................................................................................................................... 42
5 Product handling ........................................................................................................ 43
5.1 Packaging, shipping, storage and moisture preconditioning ..................................................................................................... 43
5.2 Soldering ............................................................................................................................................................................... 43
5.2.1 Soldering paste .................................................................................................................................................................. 43
5.2.2 Reflow soldering ................................................................................................................................................................ 43
5.2.3 Optical inspection .............................................................................................................................................................. 44
5.2.4 Cleaning ........................................................................................................................................................................... 44
5.2.5 Repeated reflow soldering.................................................................................................................................................. 44
5.2.6 Wave soldering .................................................................................................................................................................. 45
5.2.7 Hand soldering .................................................................................................................................................................. 45
5.2.8 Rework ............................................................................................................................................................................. 45
5.2.9 Conformal coating ............................................................................................................................................................. 45
5.2.10 Casting ......................................................................................................................................................................... 45
5.2.11 Grounding metal covers ................................................................................................................................................ 45
5.2.12 Use of ultrasonic processes ............................................................................................................................................ 46
5.3 EOS/ESD/EMI precautions ....................................................................................................................................................... 46
5.3.1 Electrostatic discharge (ESD) ............................................................................................................................................... 46
5.3.2 ESD handling precautions................................................................................................................................................... 46
5.3.3 ESD protection measures ................................................................................................................................................... 47
5.3.4 Electrical Overstress (EOS)................................................................................................................................................... 47
5.3.5 EOS protection measures ................................................................................................................................................... 47
5.3.6 Electromagnetic interference (EMI) ..................................................................................................................................... 48
5.3.7 Applications with wireless modules LEON / LISA .................................................................................................................. 49
6 Product testing ........................................................................................................... 51
6.1 u-blox in-series production test ............................................................................................................................................... 51
6.2 Test parameters for OEM manufacturer .................................................................................................................................. 51
6.3 System sensitivity test ............................................................................................................................................................. 52