u-blox ZOE-M8 Series - Page 5

ZOE-M8 series - Hardware Integration Manual
UBX-16030136 - R07 Production Information Contents
Page 5 of 32
2.13.1 Electrostatic Discharge (ESD) ........................................................................................................ 20
2.13.2 ESD protection measures ............................................................................................................. 21
2.13.3 Electrical Overstress (EOS) ............................................................................................................ 21
2.13.4 EOS protection measures ............................................................................................................. 21
2.13.5 Electromagnetic interference (EMI) .............................................................................................. 21
2.13.6 Applications with cellular modules .............................................................................................. 22
3 Product handling & soldering .................................................................................... 24
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 24
3.2 ESD handling precautions ................................................................................................................... 24
3.3 Safety precautions .............................................................................................................................. 24
3.4 Soldering ............................................................................................................................................ 25
3.4.1 Soldering paste............................................................................................................................ 25
3.4.2 Reflow soldering ......................................................................................................................... 25
3.4.3 Optical inspection ........................................................................................................................ 25
3.4.4 Repeated reflow soldering ........................................................................................................... 25
3.4.5 Wave soldering............................................................................................................................ 25
3.4.6 Rework ........................................................................................................................................ 25
3.4.7 Use of ultrasonic processes .......................................................................................................... 25
4 Product testing ........................................................................................................... 26
4.1 Test parameters for the OEM manufacturer ........................................................................................ 26
4.2 System sensitivity test ......................................................................................................................... 26
4.2.1 Guidelines for sensitivity tests ...................................................................................................... 26
4.2.2 ‘Go/No go’ tests for integrated devices ........................................................................................ 26
Appendix .......................................................................................................................... 27
A Component selection ................................................................................................. 27
A.1 External RTC (Y1) ................................................................................................................................ 27
A.2 RF band-pass filter (F1) ....................................................................................................................... 27
A.3 Optional SQI flash (U3) ....................................................................................................................... 28
A.4 Inductor for the DC/DC converter (L1) ................................................................................................ 28
A.5 External LNA (U1) ............................................................................................................................... 28
A.6 RF ESD protection diode ..................................................................................................................... 29
A.7 Ferrite beads (FB1) .............................................................................................................................. 29
A.8 Feed-thru capacitors ........................................................................................................................... 29
A.9 Standard capacitors ............................................................................................................................ 29
B Glossary ...................................................................................................................... 30
Related documents........................................................................................................... 31
Revision history ................................................................................................................ 31
Contact .............................................................................................................................. 32