上海维宏电子科技股份有限公司
Weihong Electronic Technology Co., Ltd.
30 Specialized, Concentrated, Focused
K_: number of repeats
Hole-machining process is as shown in Fig. 4-19. It is easy to break and remove chips by
intermittent feeding in Z-axis. Q specifies each time cutting depth, and ―‖ is set by the parameter
(G73_G83 retract amount).
Point R
Q
Q
Q
Point Z
P
δ: Parameter setting
δ
δ
G98
（X,Y）
Initial Point
Point R
Q
Q
Q
Point Z
P
δ: Parameter setting
δ
δ
G99
（X,Y）
Initial Point
Fig. 4-19 G73 Machining Process
Process Description:
1. The cutter rapidly moves to the specified hole position (X, Y);
2. Moves to the appointed point R;
3. Moves down Q relative to the present drilling depth;
4. Rapidly moves upward retract distance (set by the parameter ―retract amount‖);
5. Repeats the above drilling operations until reaching point Z at the bottom of hole;
6. Returns to the initial point (G98) or R point (G99) at G00 speed;
Programming Example:
F1200. S600
M03 ’spindle CW on
G90
G00 X0. Y0. Z10. ’moving to the initial point.
G17
G90 G99
’Setting coordinates of point R, point Z and hole 1, with cutting depth each time as 2.0, and
drilling speed as 800
G73 X5. Y5. Z-10. R-5. Q2. F800
X25. ’hole 2
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