Xilinx SP701 - Board Features

Board Features
The SP701 evaluaon board features are listed here. Detailed informaon for each feature is
provided in Chapter 3: Board Component Descripons.
• XC7S100-2FGGA676 package
• Form factor: 6.00 in (152.4 mm) square, 0.08844 in (88.44 mils) thick
• Conguraon:
○ Quad SPI (QSPI) 1 Gb
○ Direct QSPI ash program header
○ USB-to-JTAG bridge
• DDR3L SDRAM memory:
○ 256Mx16 4 Gb DDR3-1866
• 32 Kb I2C EEPROM for hardware ID storage accessible by FPGA and System Controller
• Clocks:
○ I2C programmable SYSCLK oscillator 33.33 MHz
• VITA 57.1 FMC-LPC connector:
○ 34 dierenal pairs or 68 single-ended LA[00-33] bus
• 2x 10/100/1000 Tri-Speed Ethernet PHY
• Mobile industry processor interface (MIPI) features:
○ MIPI-CSI Camera Serial Interface (for PCAM 5C from Digilent)
○ MIPI-DSI Display Serial Interface
• HDMI output (1.4 specicaon support)
• USB-UART interface:
○ FT4232H JTAG/3xUART
• System Controller (MSP430)
• I2C Bus
• 6x Pmod rt-angle receptacle (Digilent Pmod IF 1.2.0 specicaon support)
• General purpose I/O (GPIO):
○ 8x LED (GPIO_LED[0:7]) (acve-High)
○ 5x pushbuon switch, geographical, GPIO_SW_[N,E,S,W,C] (acve-High)
Chapter 1: Introduction
UG1319 (v1.0) July 12, 2019 www.xilinx.com
SP701 Board User Guide 6
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