Xilinx SP701 - Board Specifications

○ 1x pushbuon switch, CPU_RESET (acve-High)
○ 2x 8-pole DIP switch, GPIO_DIP_SW_B[0:15] (acve-High)
• Operaonal Switches:
○ Power On-O slide switch
○ PROG_B pushbuon switch (acve-Low)
○ 4-pole conguraon mode DIP switch M[0:2]_0_SW, INIT_B_0 (acve-Low)
• Operaonal Status LEDs:
○ Done
○ Power On
○ PG (Power Good)
• Power System:
○ V
ccint
0.90V or 1.00V (I2C selectable)
○ I2C telemetry on 12V input and V
ccint
Board Specifications
Dimensions
• Height: 6.00 in (152.4 mm)
• Width: 6.00 in (152.4 mm)
• Thickness: 0.08844 in (88.44 mils)
Note: A 3D model of this board is not available.
See the SP701 board website documentaon tab (Board Files check box) for the XDC lisng and
board schemacs (0381874).
Environmental
• Temperature
○ Operang: 0°C to +45°C
○ Storage: –25°C to +60°C
• Humidity
○ 10% to 90% non-condensing
Chapter 1: Introduction
UG1319 (v1.0) July 12, 2019 www.xilinx.com
SP701 Board User Guide 7
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