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General| Device Family | Spartan-6 |
|---|---|
| Category | FPGA |
| Number of Logic Cells | 3, 840 to 147, 443 |
| Block RAM | 216 Kb to 4, 824 Kb |
| Maximum User I/O | 102 to 576 |
| Process Technology | 45nm |
| Operating Voltage | 1.2V |
| Number of DSP Slices | 8 to 180 |
| Package Options | FG256, FG484, FG676, FG900, FG1156, FT256, FTG256, FTG484, FTG676, FTG900, FTG1156 |
Explains the principles of signal transmission over traces and reference planes.
Covers capacitor selection, placement, and guidelines for PDS.
Details electrical characteristics of PCB capacitors and substitution guidelines.
Offers guidelines for optimizing capacitor placement and mounting for low inductance.
Details placement and mounting geometries for 4.7 µF capacitors.
Details placement and mounting geometries for 0.47 µF capacitors.
Explains PDS concepts like noise limits, voltage variance, and component roles.
Discusses techniques and tools for predicting PDS performance.
Describes methods for measuring PDS noise magnitude and spectrum.
Explains using spectrum analyzers or FFT for determining noise frequencies.
Describes using measurements and simulations to optimize PDS design.
Addresses common PDS noise issues and suggested resolution methods.
Details trace geometry, routing, and characteristic impedance for high-speed signals.
Explains TDR techniques for identifying excess capacitance or inductance in transitions.
Guidelines for pin planning multi-function configuration pins to avoid conflicts.
Covers pin planning considerations for the Memory Controller Block (MCB).
Pin planning considerations for GTP transceivers, including REFCLK connections.
Advises on defining pin placement for PCI Express before other IP.
Guides on selecting clock structures and ensuring buffer availability.
Defines I/O standards, attributes, and banking rules for pin assignments.
Explains using DRCs in software tools to validate clocking and pin assignments.
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