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Xilinx Spartan-6 FPGA Series User Manual

Xilinx Spartan-6 FPGA Series
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40 www.xilinx.com Spartan-6 FPGA PCB Design and Pin Planning
UG393 (v1.1) April 29, 2010
Chapter 3: SelectIO Signaling
is higher than the voltage of the P signal, the state is considered Low. Typically the P and N
signals have similar swing, and have a common-mode voltage above GND (although this
is not always the case). LVDS is one common example of a differential I/O standard.
SDR versus DDR Interfaces
The difference between Single Data Rate (SDR) and Double Data Rate (DDR) interfaces has
to do with the relationship of the data signals of a bus to the clock signal of that bus. In SDR
systems, data is only registered at the input flip-flops of a receiving device on either the
rising or the falling edge of the clock. One full clock period is equivalent to one bit time. In
DDR systems, data is registered at the input flip-flops of a receiving device on both the
rising and falling edges of the clock. One full clock period is equivalent to two bit times.
The distinction of SDR and DDR has nothing to do with whether the I/O standard carrying
the signals is single-ended or differential. A single-ended interface can be SDR or DDR,
and a differential interface can also be SDR or DDR.
Single-Ended Signaling
A variety of single-ended I/O standards are available in the Spartan-6 FPGA IOB
configuration options.
Modes and Attributes
Some of these I/O standards can be used only in unidirectional mode, while some can be
used in bidirectional mode or unidirectional mode.
Some I/O standards have attributes to control drive strength and slew rate, as well as the
presence of weak pull-up or pull-down, and weak-keeper circuits (not intended for use as
parallel termination), and stronger input-termination resistors. Drive strength, slew rate,
and in some cases specifying untuned output driver impedance can be used to tune an
interface for adequate speed while not overdriving the signals. Weak pull-ups, weak pull-
downs, and weak keepers can be used to ensure a known or steady level on a floating or 3-
stated signal. See the Spartan-6 FPGA SelectIO Resources User Guide for more information.
Input Thresholds
The input circuitry of the single-ended standards fall into two categories: those with fixed
input thresholds and those with input thresholds set by the V
REF
voltage. The use of V
REF
has three advantages:
It allows for tighter control of input threshold levels
It removes dependence on die GND for the threshold reference
It allows for input thresholds to be closer together, which reduces the need for a large
voltage swing of the signal at the input receiver
Two 1.8V I/O standards that illustrate this are LVCMOS18 and SSTL18 Class 1. When a
Spartan-6 FPGA is receiving, the input thresholds, V
IL
and V
IH
, are much closer together
for the SSTL18 standard.
This smaller required swing allows for higher frequency of operation in the overall link. A
smaller swing at the driver means reduced DC power is required with less transient
current. The one drawback to the use of V
REF
is that the semi-dedicated V
REF
pins of the
bank cannot be used as I/Os – they must all be connected to an external reference voltage
with a decoupling capacitor for each V
REF
pin. For more information on V
REF
decoupling
and decoupling of all other supplies, see Chapter 2, Power Distribution System.

Table of Contents

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Xilinx Spartan-6 FPGA Series Specifications

General IconGeneral
Device FamilySpartan-6
CategoryFPGA
Number of Logic Cells3, 840 to 147, 443
Block RAM216 Kb to 4, 824 Kb
Maximum User I/O102 to 576
Process Technology45nm
Operating Voltage1.2V
Number of DSP Slices8 to 180
Package OptionsFG256, FG484, FG676, FG900, FG1156, FT256, FTG256, FTG484, FTG676, FTG900, FTG1156

Summary

Chapter 1: PCB Technology Basics

Transmission Lines

Explains the principles of signal transmission over traces and reference planes.

Chapter 2: Power Distribution System

PCB Decoupling Capacitors

Covers capacitor selection, placement, and guidelines for PDS.

Capacitor Specifications

Details electrical characteristics of PCB capacitors and substitution guidelines.

PCB Capacitor Placement and Mounting Techniques

Offers guidelines for optimizing capacitor placement and mounting for low inductance.

0805 Ceramic Capacitor

Details placement and mounting geometries for 4.7 µF capacitors.

0402 Ceramic Capacitor

Details placement and mounting geometries for 0.47 µF capacitors.

Basic PDS Principles

Explains PDS concepts like noise limits, voltage variance, and component roles.

Simulation Methods

Discusses techniques and tools for predicting PDS performance.

PDS Measurements

Describes methods for measuring PDS noise magnitude and spectrum.

Noise Spectrum Measurements

Explains using spectrum analyzers or FFT for determining noise frequencies.

Optimum Decoupling Network Design

Describes using measurements and simulations to optimize PDS design.

Troubleshooting

Addresses common PDS noise issues and suggested resolution methods.

Chapter 3: SelectIO Signaling

Chapter 4: PCB Materials and Traces

Traces

Details trace geometry, routing, and characteristic impedance for high-speed signals.

Chapter 5: Design of Transitions for High-Speed Signals

Time Domain Reflectometry

Explains TDR techniques for identifying excess capacitance or inductance in transitions.

Chapter 6: I/O Pin and Clock Planning

Configuration Modes

Guidelines for pin planning multi-function configuration pins to avoid conflicts.

Memory Controller Block

Covers pin planning considerations for the Memory Controller Block (MCB).

GTP Transceivers

Pin planning considerations for GTP transceivers, including REFCLK connections.

PCI Express

Advises on defining pin placement for PCI Express before other IP.

Global and I/O Clocking

Guides on selecting clock structures and ensuring buffer availability.

I/O Standards and I/O Banking Rules

Defines I/O standards, attributes, and banking rules for pin assignments.

Running Design Rule Checks

Explains using DRCs in software tools to validate clocking and pin assignments.

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