EasyManua.ls Logo

Xilinx Spartan-6 FPGA Series User Manual

Xilinx Spartan-6 FPGA Series
72 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #62 background imageLoading...
Page #62 background image
62 www.xilinx.com Spartan-6 FPGA PCB Design and Pin Planning
UG393 (v1.1) April 29, 2010
Chapter 6: I/O Pin and Clock Planning
that require V
REF
pins in bank 1 and also use the BPI configuration mode. Designers need
to review the tradeoffs before dedicating multi-function pins.
Designs using the Master SelectMAP configuration mode must be able to manage toggling
pins during configuration since the address bus A[25:0], and the BUSY, FOE_B, FCS_B, and
FWE_B multi-function pins can toggle during the configuration process.
Memory Controller Block
The BPI configuration mode cannot be used when the design uses the memory controller
block (MCB) in bank 1. Conversely, when configuring in BPI mode, the MCB in bank 1 can
not be used.
Configuration Options
Proper design planning considers any pins required by the configuration options.
Readback
Ensure that the configuration pins that will persist as configuration pins for readback are
not used as user I/O by the design. The table in the Reserving Dual-Purpose Configuration
Pins (Persist) section (Chapter 5) of the Spartan-6 FPGA Configuration Guide lists the pins
that will persist for each configuration mode.
Readback CRC
Readback CRC requires that the INIT_B pin be used as the CRC error flag. Therefore, the
INIT_B pin is not available as a user I/O unless the CRC error flag is disabled by using the
constraint: POST_CRC_INIT_FLAG = DISABLE. Chapter 8 of the Spartan-6 FPGA
Configuration Guide contains more details on Readback CRC including a UCF file design
implementation example.
External Clock Option for Master Configuration Modes
The USERCCLK option for the Master configuration modes uses the same I/O as the
GCLK0 pin.
Memory Controller Block
MCB Pin Planning Considerations
The Spartan-6 FPGA MCB shares multi-function I/O pins with other functions such as
GCLK and configuration pins. When using these pins for the MCB, they cannot be used for
the other functions. The Memory Interface Generator (MIG) tool in the Core Generator
software generates the specific pin assignments for each MCB.
Note:
The MCB in I/O bank 1 has the most multi-function pin conflicts. To avoid these conflicts, use
the MCBs in other I/O banks whenever possible.
In addition to the typical interface pins associated with memory interfaces, two additional
user I/O pins are usually required: RZQ and ZIO. The MIG tool adds these two additional
I/O pins automatically. See the Spartan-6 FPGA Memory Controller User Guide for more
information on their usage and required terminations.

Table of Contents

Question and Answer IconNeed help?

Do you have a question about the Xilinx Spartan-6 FPGA Series and is the answer not in the manual?

Xilinx Spartan-6 FPGA Series Specifications

General IconGeneral
Device FamilySpartan-6
CategoryFPGA
Number of Logic Cells3, 840 to 147, 443
Block RAM216 Kb to 4, 824 Kb
Maximum User I/O102 to 576
Process Technology45nm
Operating Voltage1.2V
Number of DSP Slices8 to 180
Package OptionsFG256, FG484, FG676, FG900, FG1156, FT256, FTG256, FTG484, FTG676, FTG900, FTG1156

Summary

Chapter 1: PCB Technology Basics

Transmission Lines

Explains the principles of signal transmission over traces and reference planes.

Chapter 2: Power Distribution System

PCB Decoupling Capacitors

Covers capacitor selection, placement, and guidelines for PDS.

Capacitor Specifications

Details electrical characteristics of PCB capacitors and substitution guidelines.

PCB Capacitor Placement and Mounting Techniques

Offers guidelines for optimizing capacitor placement and mounting for low inductance.

0805 Ceramic Capacitor

Details placement and mounting geometries for 4.7 µF capacitors.

0402 Ceramic Capacitor

Details placement and mounting geometries for 0.47 µF capacitors.

Basic PDS Principles

Explains PDS concepts like noise limits, voltage variance, and component roles.

Simulation Methods

Discusses techniques and tools for predicting PDS performance.

PDS Measurements

Describes methods for measuring PDS noise magnitude and spectrum.

Noise Spectrum Measurements

Explains using spectrum analyzers or FFT for determining noise frequencies.

Optimum Decoupling Network Design

Describes using measurements and simulations to optimize PDS design.

Troubleshooting

Addresses common PDS noise issues and suggested resolution methods.

Chapter 3: SelectIO Signaling

Chapter 4: PCB Materials and Traces

Traces

Details trace geometry, routing, and characteristic impedance for high-speed signals.

Chapter 5: Design of Transitions for High-Speed Signals

Time Domain Reflectometry

Explains TDR techniques for identifying excess capacitance or inductance in transitions.

Chapter 6: I/O Pin and Clock Planning

Configuration Modes

Guidelines for pin planning multi-function configuration pins to avoid conflicts.

Memory Controller Block

Covers pin planning considerations for the Memory Controller Block (MCB).

GTP Transceivers

Pin planning considerations for GTP transceivers, including REFCLK connections.

PCI Express

Advises on defining pin placement for PCI Express before other IP.

Global and I/O Clocking

Guides on selecting clock structures and ensuring buffer availability.

I/O Standards and I/O Banking Rules

Defines I/O standards, attributes, and banking rules for pin assignments.

Running Design Rule Checks

Explains using DRCs in software tools to validate clocking and pin assignments.

Related product manuals