ADT 7100 - Page 26

ADT 7100 User Manual
3
Supported Processes
OVERVIEW
This chapter covers the characterized processes for the tool. Any processes outside of the
ones listed must be approved by a tool engineer and require additional training. Please refer to
the LNF wiki for more information.
3.1 STANDARD RECIPES
We have created various template recipes for processing some of the common materials. You can
find them in the Standard group. Some of the recipe parameters are listed next.
Recipe Name
Designed
to dice:
Blade
Cut speeds
Entry/Cut/Exit
(mm/sec)
Spindl
e
speed
(krpm)
Max
recommended
thickness per
pass (mm)
Comments
STD_Silicon-1
Silicon
S1230-Q5HH-000
5 / 10 / 5
30
0.6
This is the standard recipe for silicon
wafers
STD_Silicon-2
Silicon
S2550-Q5HH-000
5 / 10 / 5
30
1.1
This is the standard recipe for thick
silicon wafers (up to 1.1 mm)
STD_Glass-1
Glass, Si,
fused silica
00777-1030-008-QKP
2.5 / 5 / 2.5
24
0.5
Standard recipe for glass using blade
1030 to reduce chipping
STD_Glass-2
Glass, Si,
fused silica
00777-1045-008-QKP
2.5 / 5 / 2.5
24
0.5
Standard recipe for glass using blade
1045 to reduce blade wearing
STD_Saphire
Sapphire
00777-1045-008-QKP
0.5 / 1 / 1
20
0.25
Recipe tuned to cut tough materials
such as sapphire with low chipping
STD_Alumina
Alumina
00777-1045-008-QKP
1.5 / 2.5 / 1.5
24
0.5
Recipe tuned to cut tough material
STD_GaAs
GaAs
S1230-Q5HH-000
2 / 5 / 2
25
0.6
Recipe tuned to dice GaAs
STD_BiTe
BiTe
00777-1045-008-QKP
3.5 / 3.5 / 3.5
24
0.5
Recipe tuned to dice BiTe
STD_SiC
SiC
00777-1045-008-QKP
0.5 / 1 / 0.5
10
0.5
Recipe tuned to dice BiTe
Lurie Nanofabrication Facility 3-1