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Bosch BME280 - Environmental Safety; Rohs Compliancy; Halogen Content; Internal Package Structure

Bosch BME280
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Document number BST-BME280-HS006-00 | May 2018 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
Bosch Sensortec | HSMI BME280
10 | 24
4. Environmental safety
4.1. RoHS compliancy
The BME280 sensor meets the requirements of the EC directive Restriction of hazardous substances
(RoHS)”, see also:
“Directive 2002/95/EC of the European Parliament and of the Council of 11 September 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment”.
The BME280 is also Lead(Pb)-free and halogen-free.
4.2. Halogen content
The BME280 is halogen-free. For more details on the analysis results please contact your Bosch
Sensortec representative.
4.3. Internal package structure
Within the scope of Bosch Sensortec’s ambition to improve its products and secure the mass product
supply, Bosch Sensortec qualifies additional sources (e.g. 2
nd
source) for the LGA package of the
BME280.
While Bosch Sensortec took care that all of the technical packages parameters are described above are
100% identical for all sources, there can be differences in the chemical content and the internal structural
between the different package sources.
However, as secured by the extensive product qualification process of Bosch Sensortec, this has no
impact to the usage or to the quality of the BME280 product.
5. Mounting recommendations
MEMS sensors in general are high-precision measurement devices which consist of electronic as well as
mechanical silicon structures. Bosch Sensortec MEMS sensor devices are designed for precision,
efficiency and mechanical robustness.
However, in order to achieve best possible results for your design, the following recommendations should
be taken into consideration when mounting combined humidity and pressure sensor on a printed-circuit
board (PCB).

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