Document number BST-BME280-HS006-00 | May 2018 Bosch Sensortec
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
5.3. Additional recommendation details
Please avoid rear side handling of the BME280 sensor, otherwise the device can be destroyed
It is generally recommended to keep a reasonable distance between the sensor mounting
location on the PCB and the critical points described in the following examples. The exact value
for a “reasonable distance” depends on many customer specific variables and must therefore be
determined case by case
It is not recommended to place the sensor directly under or next to push-button contacts as this
can result in mechanical stress
It is not recommended to place the sensor close to the edge of the PCB
It is not recommended to place the sensor in direct vicinity of extremely hot spots (e.g. a
µController) as this can result in heating-up the sensor
Do not mount the sensor too close to a PCB anchor point, where the PCB is attached to a shelf
(or similar) as this could also result in mechanical stress
Please avoid total or partial coverage of the sensor by any kind of (epoxy) resin, as this can
possibly result in mechanical stress and could clog the hole in the sensor’s top lid
The clearance above the metal lid of the BME280 shall be 0.1mm at minimum
For the device housing appropriate venting needs to be provided in case the ambient pressure
shall be measured
The sensor has to be protected against all kinds of liquids, during processing (e.g. solder flux,
cleaning agents) and during operation, strong air blasts from an air-pistol (not oil-free air) are also
forbidden. Applying liquids, cleaning agents or solder flux to the sensor may cause to drift of the
reading or complete malfunction of the sensor. Low viscose coatings or potting materials can
enter the sensor hole, get onto the MEMS sensor chip and damage the sensor element (pressure
and/or humidity).
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