Document number BST-BME280-HS006-00 | May 2018 Bosch Sensortec
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Note: Specifications within this document are subject to change without notice.
Index of Contents
1. Package outline dimensions ........................................................................................................ 5
1.1. Top view .............................................................................................................................. 5
2. Device marking .............................................................................................................................. 6
2.1. Mass production devices ..................................................................................................... 6
2.2. Engineering samples ........................................................................................................... 6
3. Moisture sensitivity level and soldering .................................................................................... 7
3.1. MSL and device storage ...................................................................................................... 7
3.2. Multiple reflow soldering cycles ........................................................................................... 7
3.3. Reconditioning Procedure ................................................................................................... 8
3.4. Classification reflow profile .................................................................................................. 8
4. Environmental safety .................................................................................................................. 10
4.1. RoHS compliancy .............................................................................................................. 10
4.2. Halogen content ................................................................................................................ 10
4.3. Internal package structure ................................................................................................. 10
5. Mounting recommendations ...................................................................................................... 10
5.1. Recommendation details for the humidity measurement.................................................... 11
5.2. Thermal coupling of the sensor element ............................................................................ 14
5.3. Additional recommendation details .................................................................................... 15
5.4. Push-button contacts ......................................................................................................... 17
5.5. Hot-spots on the PCB ........................................................................................................ 18
5.6. PCB anchor points ............................................................................................................. 18
5.7. Resin coatings ................................................................................................................... 19
5.8. Minimum distance between Sensor and PCB .................................................................... 19
5.9. Underfill and cleaning materials ......................................................................................... 20
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