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DISASSEMBLY PROCEDURE
6. Main-I/O Board Removal
6.1 Perform procedure 1.
6.2 Remove the 7 screws that secure the
Main-I/O board as indicated in Figure 21.
6.3 Detach the 1 FFC cable that attaches to
the Display board as red arrow indicated in
Figure 21.
6.4 Remove the 6 screws that secure the
Channel input jacks. See Figure 22.
Re-assembly Note:
There are no Device ID concerns when re-
placing the Main-I/O board. The Device ID is
assigned at the factory. Service replacement
Main-I/O PCBA’s use the PCBA serial num-
ber instead of the system serial number. As a
result, the system serial number will not show
up in the S1 Pro+ Wireless PA System app.
7. Display Board Removal
7.1 Perform procedure 1.
7.2 Remove the 4 screws securing the
Display board as indicated in Figure 23.
7.3 Detach the FFC Cable that is attaching the
Main-I/O board. See Figure 23.
7.4 Apply Isopropyl Alcohol to the around of
the OLED to decrease gasket's adhesion. See
Figure 24 (left).
7.5 Separate the OLED using the tweezers.
Note: Don't force the OLED to avoid damage.
Figure 22. 6 Screws Location
Figure 23. 4 Screws & 1 FFC Cable Location
Figure 21. 7 Screws & 1 FFC Cable Location
Figure 24. OLED Removal
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