FAULTFINDING
©CyrusAudioLtdJun2014 12 Cyrus6DAC,Cyrus8DACservicemanualIssue1
The amplifiers are complex, microcontrolled products using small‐scale SMD technology. Do
not attempt anyfault‐finding orrepairon oneofthese productsunlessyou are acompetent
audioengineerwiththecorrectSMDrepairtoolsandtrainedtofault‐findonthisequipment.
This fault‐finding guide is not exhaustive, but should help a competent engineer trace faults
within the amplifier. If you require more technical help than this guide, contact the Cyrus
ServiceDepartment.
CAUTION
The high‐efficiency heat‐transfer insulation pads fitted between the power amplifier output
transistors and the chassis of the amplifiers are designed to soften, melt and bond to the
transistorandheatsinkwhentheamplifierfirstheatsup. This istoenablethepadstofillany
pits in the surface of the heatsink and provide an excellent thermal bond between the
transistorandheatsink.ForthisreasonanypadmaterialmustALWAYSbecompletelyscraped
from the heatsink and the pads replaced if the seal is broken between the transistor and
heatsink,as they will notre‐bond.Conventionalpads
andgrease are much less efficient heat
conductorsandarenotanacceptablesubstituteforthecorrectpads. Useofalternativepads
will risk future failure of the amplifier. Always obtain original pads from the Cyrus Service
Department.
Layoutoftheamplifier
The amplifier is constructed with the analogue pre‐amplifier, power amplifier and power
supplylayingon the main PCB fixed inthe base of the chassis, andasmallersubPCBlocated
overthisthatincludestheheadphoneamplifier,thepowersupplyforthedisplaybacklight,the
circuitry for the digital inputs and the D/A converter. The analogue audio output from the
digital audiosection of the sub PCBconnects to thepreamplifier onthe mainPCB through a
cable.
ThecircuitrythatcontrolstheamplifierislocatedonthefrontpanelPCBwiththeLCDdisplay.
Dismantlingtheamplifier
Basic tests, alignment and fuse replacement are possible without removing the sub PCB. All
alignmenttestpointsonthemainPCBandtherightchanneladjustmentpresetsareaccessible
aroundtheborderofthesubPCB.Theleftchanneladjustmentpresetscanbereachedthrough
anaccessholeinthesubPCB.
Foraccesstotestorrepairthepreamplifieror poweramplifierstages,thesubPCBmustfirst
beremoved.WiththesubPCBremoved,theamplifier willcontinuetofunctionasnormalfor
testandrepair,butwithoutthedisplaybacklightordigitalinputs.
The sub PCB cannot simply
be unplugged from its main PCB connector without damage. To
removethesubPCBleavingthemainPCBinthechassis,removethescrewssecuringtherear
paneltothesubPCB and the two along thetopedgefixingittothechassis.Removethenut
securingtheheadphonesocket(special toolrequired).Oncethescrewsareremoved,therear
panelcanbetiltedbackslightlytoallowclearancetoremovethesubPCBfromitsconnector.
CAUTION:Whenre‐fitting thesub‐PCB,takeparticularcaretoensurethattheconnector pins
arecorrectlyaligned.Misalignmentofthepinswillcauseconsiderabledamagetothesub‐PCB.
Initialprecautionsandfirsttests
Before connecting power to an amplifier that is suspected to be faulty, ensure that
loudspeakersandloadsaredisconnectedfromthespeakersocketstoavoiddamagingthem.