SMDCOMPONENTREPLACEMENT
©CyrusAudioLtdJun2014 6 Cyrus6DAC,Cyrus8DACservicemanualIssue1
Usetin/silversolderwhichhasalowermeltingpoint.Tin/silversolderpasteorsmallgauge
solder (26SWG) isrecommended. Do notuse solder containingleadwhen servicing these
products.
Whenusingsolderpasteapressuredispensershouldbeusedtoensurethecorrectamount
ofsolderisappliedtoeachpad.
Solder paste should not be used with direct heating methods as the solder between
componentpinsmaynotbemelted.
Ifnecessary,removeexcesssolderpastewithsolderbraid.
RemovingSMDresistorsandcapacitorsfromthePCBwithasolderingiron
1. Fitthesolderingironwithatiplargeenoughtobridgebothendsofthecomponent.
2. Placethesolderingironsothatitsflattipwillheatbothendsofthecomponentatonce.
3. Whenthesoldermelts,removethecomponentwithtweezers.
4. Allow the PCB
to cool for a few minutes, removing any excess solder with desoldering
braid.
FittingreplacementSMDresistorsandcapacitorstothePCBwithasolderingiron
1. Applyalittlefluxtotheconnections.
2. Placethecomponentinposition.
3. Tin the soldering iron, bringthe tip into contact withthe PCBpad andflow solder to the
joint.Avoidbringingthesolderingirontipdirectlyintocontactwiththecomponent.
RemovingSMDICsfromthePCB
1. Using fine tipped side cutters or tweezer cutters, snip all the leads of the device and
removetheICbody.
2. DesoldertheleadsfromthePCBpads.
3. CleanupthePCBwithsolderbraid.
RemovingSMDICswithahotairSMDtool
1. FitasuitablesizetipfortheICbeingremoved.
2. HeattheICevenlyuntilthesoldermelts.
3. RemovetheICwithtweezers.
FittingreplacementICstothePCBwithasolderingiron
1. CheckthatthepinsoftheICarenotdistorted.
2. Usingtweezers,positiontheICoverthefootprint.
3. CheckthatalltheICpinsarecorrectlyalignedwiththepads.
4. Withaveryfinetipsolderingiron,solderinthepinsatthecornersofthe
IC.
5. Re‐checkthealignmentandcorrectifnecessary.
6. WhenthealignmentisOK,soldertheremainingpinsoftheICtothePCB.