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Fujitsu Airstage J-II - Page 200

Fujitsu Airstage J-II
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Remove the 4 mounting screws. Remove the connectors and spacers.
Remove the connectors. Remove the screws.
06-04
Screws (For Diode Bridge)
Diode Bridges
Screws
(For IPM)
Hook
Spacers
Screws
6-2. INVERTER PCB removal
6-3. ACTPM removal
Spread the heat transfer compound on IPM and Diode Bridges
when you exchange INVERTER PCB by the repair.
For screws of IPM.
Note the tightening torque at the installation.
1. Temporary tightening : 0.2 to 0.4N m
2. Final tightening : 0.98 to 1.47N m
For screws of Diode Bridge.
Note the tightening torque at the installation.
1. Temporary tightening : 0.2 to 0.4N m
2. Final tightening : 0.5 to 0.8N m
Note at the installation.
1. Remove the old heat transfer compound as possible from IPM and
Diode Bridges when you exchange INVERTER PCB by the repair.
2. Spread the heat transfer compound evenly on IPM and Diode Bridges.
3. Prevent foreign matter from attaching to the surface of IPM and Diode Bridges.
Note at the installation.
1. Remove the old heat transfer compound as possible from
ACTPM when you exchange ACTPM by the repair.
2. Spread the heat transfer compound evenly on ACTPM.
3. Prevent foreign matter from attaching to the surface of ACTPM.
For screws of ACTPM.
Note the tightening torque at the installation.
1. Temporary tightening : 0.2 to 0.4N m
2. Final tightening : 0.6 to 0.9N m
- Manufacturer : Shin-Etsu Chemical Co.,Ltd
- Grade : G746
Specifications for the heat transfer compound
Spread the heat transfer compound on ACTPM
when you exchange ACTPM by the repair.
- Manufacturer : Shin-Etsu Chemical Co.,Ltd
- Grade : G746
Specifications for the heat transfer compound
IPM

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