MP: Mid Plane
Board that is located between the front of the enclosure and the rear of the enclosure (the controller
(CM) side)
PSU: Power Supply Unit
Figure 103 Maximum Configuration Diagram: ETERNUS AF250
CE
IOC
EXP
CPU
BUD
CA
CM#0
EXP
CPU
MemoryMemory
IOC
CM#1
MP
BUD
SCU SCU
PSU PSU
PANEL
DE
EXP
IOM#0 IOM#1
PSU PSU
MP
EXP
PANEL
C
A CA CA
PANEL: Operation Panel
CE: Controller Enclosure
CM: Controller Module
CA: Channel Adapter
Host Interface
Memory: System Memory
BUD: Bootup and Utility Device
•
Backup area in case of power outage
•
Storage area for firmware
SCU: System Capacitor Unit
Backup power source in case of power outage
IOC: I/O Controller
Controller to control I/O
EXP: SAS Expander
Expander chip for SAS connections
DE: Drive Enclosure
IOM: I/O Module
Unit that controls the I/O between controllers and drives
3. Hardware Configurations
Configuration Schematics
152
FUJITSU Storage ETERNUS AF250 S2, ETERNUS AF250 All-Flash Arrays
Design Guide (Basic)
Copyright 2019 FUJITSU LIMITED
P3AG-1822-09ENZ0
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