Fujitsu PRIMERGY TX100 S2 Options Guide

16 Options Guide TX100 S2
Safety instructions
Before starting up
V CAUTION!
● During installation and before operating the device, observe the
instructions on environmental conditions for your device.
● If the device is brought in from a cold to a warm environment,
condensation may form both inside and on the outside of the device.
Wait until the device has acclimatized to room temperature and is
absolutely dry before starting it up. Material damage may be caused
to the device if this requirement is not observed.
● Transport the device only in the original packaging or in packaging
that protects it from knocks and jolts.
Installation and operation
V CAUTION!
● The device may only be operated at a maximum ambient temperature
of 35°C.
● If the device is integrated in an installation that receives power from
an industrial (public) power supply network with the IEC309
connector, the (public) power supply protection must comply with the
requirements for non-industrial (public) power supply networks for the
type A connector.
● The unit automatically adjusts itself to a mains voltage in a range of
100 V - 240 V. Ensure that the local mains voltage lies within these
limits.
● This device must only be connected to properly grounded shock-
proof sockets with tested and approved power cables.
● Ensure that the device is connected to a grounded power outlet close
to the device.

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g