Fujitsu PRIMERGY TX100 S2 Options Guide

TX100 S2 Options Guide
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1 Concept and target groups . . . . . . . . . . . . . . . . . . . 9
1.2 Documentation overview . . . . . . . . . . . . . . . . . . . 10
1.3 Expansions and upgrades . . . . . . . . . . . . . . . . . . . 11
1.4 Notational conventions . . . . . . . . . . . . . . . . . . . . 12
2 Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Safety instructions . . . . . . . . . . . . . . . . . . . . . . . 15
4 Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1 Opening the server . . . . . . . . . . . . . . . . . . . . . . . 23
4.2 Removing the air duct . . . . . . . . . . . . . . . . . . . . . 27
5 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 Equipping rules . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 Extending/replacing the main memory . . . . . . . . . . . . 31
6 Accessible drives . . . . . . . . . . . . . . . . . . . . . . . 33
6.1 Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.2 Installing an accessible 5.25-inch drive . . . . . . . . . . . . 35
7 Non-accessible drives . . . . . . . . . . . . . . . . . . . . . 37
7.1 Installing and removing the hard disk drives . . . . . . . . . 37

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g