Fujitsu PRIMERGY TX100 S2 Options Guide

TX100 S2 Options Guide 19
Safety instructions
Working with CDs/DVDs/BDs and optical drives
When working with devices with optical drives, these instructions must be
followed.
V CAUTION!
● Only use CDs/DVDs/BDs that are in perfect condition, in order to
prevent data loss, equipment damage and injury.
● Check each CD/DVD/BD for damage, cracks, breakages etc. before
inserting it in the drive.
Note that any additional labels applied may change the mechanical
properties of a CD/DVD/BD and cause imbalance.
Damaged and imbalanced CDs/DVDs/BDs can break at high drive
speeds (data loss).
Under certain circumstances, sharp CD/DVD/BD fragments can
pierce the cover of the optical drive (equipment damage) and can fly
out of the device (danger of injury, particularly to uncovered body
parts such as the face or neck).
● High humidity and airborne dust levels are to be avoided. Electric
shocks and/or server failures may be caused by liquids such as water,
or metallic items, such as paper clips, entering a drive.
● Shocks and vibrations are also to be avoided.
● Do not insert any objects other than the specified CDs/DVDs/BDs.
● Do not pull on, press hard, or otherwise handle the CD/DVD/BD tray
roughly.
● Do not disassemble the optical drive.
● Before use, clean the optical disk tray using a soft, dry cloth.
● As a precaution, remove disks from the optical drive when the drive
is not to be used for a long time. Keep the optical disk tray closed to
prevent foreign matter, such as dust, from entering the optical drive.
● Hold CDs/DVDs/BDs by their edges to avoid contact with the disk
surface.

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g