Fujitsu PRIMERGY TX100 S2 Options Guide

30 Options Guide TX100 S2
Main memory
● Minimum required for booting the system is one UDIMM (socket DIMM 1A).
● Therefore, memory boards must be fitted with UDIMMs as follows.
The maximum performance can be achieved in a symmetric dual-channel
configuration. Therefore, both channels have to be populated with the same
amount of memory. The DRAM device technology may vary from one channel
to the other.
If the amount of memory differs between the two channels, the system board
will run in dual-channel asymmetric mode.
Regardless of the mode, all DIMMs will run at the highest common frequency
that is allowed by the SPD data of the DIMMs and the maximum speed of the
selected configuration.
Configuration 1: single-channel configuration
Configuration 2:
The dual-channel mode is only activated, if the size of the used memory module
in socket DIMM 1B is equal to the summary of the memory modules in the
sockets DIMM 1A and DIMM 2A
(e.g. DIMM 1A = 1GB, DIMM 2A = 1GB, DIMM 1B = 2GB).
Configuration 3 and 4:
For dual-channel configuration arrange identical memory modules in pairs of
the sockets.
Install identical memory modules in sockets DIMM 1A and DIMM 1B and
identical memory modules in sockets DIMM 2A and DIMM 2B.
Mode Configuration DIMM 1A
black
DIMM 2A
blue
DIMM 1B
black
DIMM 2B
blue
Single-
channel
1 populated - - - - - -
Single-
/dual-
channel
2 populated populated populated - -
Dual-
channel
3 populated - - populated - -
Dual-
channel
4 populated - - populated populated
Table 1: Configuration of the main memory

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g