IDL 101
TABLE OF CONTENTS
HB_IDL101_E_V222.doc
5
Gantner Instruments Test & Measurement GmbH
TABLE OF CONTENTS
1.
GENERAL PRELIMINARY REMARKS................................................................................................................. 8
1.1.
On This Manual.....................................................................................................................................................8
1.2.
Important Notice...................................................................................................................................................8
1.3.
Contact for Inquiries..............................................................................................................................................8
2.
SYSTEM DESCRIPTION .................................................................................................................................... 9
2.1.
System Overview ..................................................................................................................................................9
2.2.
Range of Application..............................................................................................................................................9
2.3.
Features of Performance...................................................................................................................................... 10
2.4.
Configuration Software ICP 100............................................................................................................................12
3.
INSTALLATION ............................................................................................................................................... 16
3.1.
Mounting / Fixing ...............................................................................................................................................16
3.2.
Protective System................................................................................................................................................16
3.3.
Ambient Temperature.......................................................................................................................................... 16
3.4.
Front of the Appliance / Pin Assignment................................................................................................................ 17
3.5.
Connection Technique ......................................................................................................................................... 18
3.6.
Power Supply......................................................................................................................................................18
3.7.
Grounding .......................................................................................................................................................... 19
3.8.
Lightning Protection ............................................................................................................................................19
3.9.
Bus Connection ................................................................................................................................................... 20
3.10.
Sensor Connection .............................................................................................................................................. 21
3.11.
Several Sensors at one Module............................................................................................................................. 21
3.12.
Module Jack
ICM 100
........................................................................................................................................... 21
3.13.
Cold Junction Terminal
ICJ 104
............................................................................................................................23
4.
STRUCTURE OF THE BUS TOPOLOGY ............................................................................................................ 24
4.1.
Bus interface....................................................................................................................................................... 25
4.2.
Bus Structure......................................................................................................................................................25
4.3.
Number of Parties ...............................................................................................................................................26
4.4.
Transmission Speed and Line Length .................................................................................................................... 26
4.5.
Bus Cable ...........................................................................................................................................................27
4.6.
Bus Plug ............................................................................................................................................................. 27
4.7.
Bus Termination.................................................................................................................................................. 27
4.8.
Shielding ............................................................................................................................................................ 29
4.9.
PC Bus Connection .............................................................................................................................................. 30
4.10.
Equipotential Bonding.......................................................................................................................................... 31
4.11.
Adjustment of Address and Baud Rate .................................................................................................................. 31
5.
SIGNAL PROCESSING..................................................................................................................................... 33
5.1.
Analog Inputs .....................................................................................................................................................33
5.2.
Digital Inputs/Outputs .........................................................................................................................................33
5.3.
Internal Reference Voltage................................................................................................................................... 34
5.4.
Internal Processing..............................................................................................................................................34
5.5.
Measurement Rate ..............................................................................................................................................35
5.6.
Signal Preparation ...............................................................................................................................................35
6.
FUNCTIONAL DESCRIPTION .......................................................................................................................... 36
6.1.
Analog Input Variable ..........................................................................................................................................36
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