b. Remove the heat sink (2) from the system board.
NOTE: Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat sink,
processor, and system board spare part kits.
The following illustrations show replacement thermal material locations.
ā Discrete graphics: Thermal paste is used on the heat sink (2) (4) and associated system board
components (1) (3).
Component replacement procedures 49
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