HP E24d G4

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screwdriver
PH0
Description #2 screwdriver
PH2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Put the monitor on softly surface, Separation monitor head and stand.
2. Unscrew VESA screws and Release the hooks of Rear cover to take out the rear cover.
3. Unscrew Side USB chassis screws and Webcam screws
4. Disassemble side usb assy and webcam assy.
5. Unscrew IO Cover screws and separate chassis assy from panel.
6. Release all the screws that fixed chassis.
7. Take out the chassis and separate internal PCB.
8. Peel off all the mylar that fixed on the chassis.
9. Release All the screws that fixed middle-frame.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).