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HP Elite x2 1012 G2 User Manual

HP Elite x2 1012 G2
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from plastic foam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Grounding guidelines 23

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HP Elite x2 1012 G2 Specifications

General IconGeneral
Form factorConvertible (Detachable)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
Display diagonal12.3 \
Touch technologyMulti-touch
Display resolution2736 x 1824 pixels
Native aspect ratio3:2
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache4 MB
Processor cores2
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-7600 Mobile Series
Processor socketBGA 1356
Processor threads4
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.8 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.9 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x2, 1x4, 2x2, 2x1, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.9 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Internal memory8 GB
Memory clock speed1866 MHz
Internal memory typeLPDDR3-SDRAM
Maximum internal memory16 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceNVMe 3.0, PCI Express
Storage mediaSSD
SSD form factorM.2
Total storage capacity512 GB
Compatible memory cardsMicroSD (TransFlash)
Number of SSDs installed1
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory32 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1150 MHz
Battery capacity47 Wh
Battery life (max)10 h
Video capturing speed30 fps
Front camera resolution1920 x 1080 pixels
Front camera signal format1080p
Rear camera resolution (numeric)8 MP
Front camera resolution (numeric)5 MP
AC adapter power65 W
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Mobile network generation4G
Sustainability certificatesENERGY STAR
Charging port typeDC-in jack
USB 2.0 ports quantity0
Pointing deviceClickpad
Processor codeSR33Z
Processor ARK ID97466
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Height14.6 mm
Weight1150 g
Depth (tablet mode)219.7 mm
Width (tablet mode)300 mm
Height (tablet mode)9.1 mm
Weight (tablet mode)800 g

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