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HP Elite x2 1012 G2 User Manual

HP Elite x2 1012 G2
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive eld service tools, such as cutters, screwdrivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and plastic
foam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
24 Chapter 4 Removal and replacement procedures preliminary requirements

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HP Elite x2 1012 G2 Specifications

General IconGeneral
Form factorConvertible (Detachable)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
Display diagonal12.3 \
Touch technologyMulti-touch
Display resolution2736 x 1824 pixels
Native aspect ratio3:2
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache4 MB
Processor cores2
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-7600 Mobile Series
Processor socketBGA 1356
Processor threads4
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.8 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.9 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x2, 1x4, 2x2, 2x1, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.9 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Internal memory8 GB
Memory clock speed1866 MHz
Internal memory typeLPDDR3-SDRAM
Maximum internal memory16 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceNVMe 3.0, PCI Express
Storage mediaSSD
SSD form factorM.2
Total storage capacity512 GB
Compatible memory cardsMicroSD (TransFlash)
Number of SSDs installed1
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory32 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1150 MHz
Battery capacity47 Wh
Battery life (max)10 h
Video capturing speed30 fps
Front camera resolution1920 x 1080 pixels
Front camera signal format1080p
Rear camera resolution (numeric)8 MP
Front camera resolution (numeric)5 MP
AC adapter power65 W
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Mobile network generation4G
Sustainability certificatesENERGY STAR
Charging port typeDC-in jack
USB 2.0 ports quantity0
Pointing deviceClickpad
Processor codeSR33Z
Processor ARK ID97466
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Height14.6 mm
Weight1150 g
Depth (tablet mode)219.7 mm
Width (tablet mode)300 mm
Height (tablet mode)9.1 mm
Weight (tablet mode)800 g

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