3. Release the heat sink (3) by sliding it up and to the right at an angle.
4.
Remove the heat sink.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board each time the heat sink is removed:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
●
Thermal pads are used on the Northbridge chip (3) and the heat sink section (4) that
services it.
●
Thermal pads are used on the Southbridge chip (5) and the heat sink section 6 that services
it.
Replacement thermal material is included with all system board and heat sink spare part kits.
Component replacement procedures
105
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