NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly, processor, and system board
spare part kits.
●
Various thermal pads are used on the graphics board components (1) and (7) and the heat sink
sections (2) and (8) that service them
●
Thermal paste is used on the processor (3) and the heat sink section (4) that services it
●
Thermal paste is used on the graphics board processor (5) and the heat sink section (6) that
services it
Reverse this procedure to install the fan/heat sink assembly.
92 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
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