Huawei ME909u-521 - Page 23

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
23
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
119
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
120
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
121
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
122
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
123
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
124
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
125
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
126
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
127
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
128
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
129
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
130
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
131
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
132
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-