Huawei ME909u-521 - Page 24

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
24
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
133
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
134
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
135
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
136
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
137
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
138
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
139
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
140
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
141
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
142
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
143
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
144
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-
145
GND
-
Thermal Ground
Pad, this pad need
thermal via
-
-
-
-
-