Datasheet 89
Boxed Processor Specifications
7 Boxed Processor Specifications
The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed
Intel processor. Boxed Intel processors are intended for system integrators who build systems from
baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will
be supplied with a cooling solution. This chapter documents baseboard and system requirements
for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land
package. This chapter is particularly important for OEMs that manufacture baseboards for system
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor
in the 775-land package.
Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designers’ responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel
®
Pentium
®
4
Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further
guidance. Contact your local Intel Sales Representative for this document.
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 7-1. Mechanical Representation of the Boxed Processor
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