Intel DH87MC User Manual

Intel Desktop Board DH87MC Technical Product Specification
60
Table 34 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 34. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H87 Express Chipset 104
o
C
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 34. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature.
For information about
Refer to
Processor datasheets and specification updates Section 1.2, page 16
Intel H87 Express Chipset http://www.intel.com/products/desktop/
chipsets/

Intel DH87MC Specifications

General

Form Factor	Micro ATX
Chipset	Intel H87
Socket	LGA 1150
Memory Slots	4
Maximum Memory	32 GB
Memory Type	DDR3
PCI Express x16	1
SATA 6Gb/s	6
USB 3.0 Ports	4
USB 2.0 Ports	8
RAID Support	RAID 0, 1, 5, 10
Ethernet	Gigabit Ethernet
Video Ports	HDMI, DVI, VGA
PCI Express x1	2 x PCIe 2.0 x1