Introduction
Thermal and Mechanical Design Guidelines 13
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core™2 Extreme Processor X6800 and Intel
®
Core™2 Duo
Desktop Processor E6000 and E4000 Series Datasheet
http://intel.com
/design/processor/datashts/3132
78.htm
Intel
®
Pentium
®
Dual-Core Desktop Processor E2000 Series
Datasheet
www.intel.com//design/processor
/datashts/316981.htm
Intel
®
Celeron
®
Dual-Core Processor E1000 Series Datasheet http://www.intel.com/design/proc
essor/datashts/318924.htm
LGA775 Socket Mechanical Design Guide http://intel.com/design/
Pentium4/guides/ 302666.htm
uATX SFF Design Guidance http://www.formfactors.org/
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
ATX Thermal Design Suggestions http://www.formfactors.org/
microATX Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
Thermally Advantaged Chassis version 1.1 http://www.intel.com/go/chassis/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note: Heat source must be specified for
Ψ measurements.
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