Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines 41
5 Balanced Technology Extended
(BTX) Thermal/Mechanical
Design Information
5.1 Overview of the Balanced Technology Extended
(BTX) Reference Design
The reference thermal module assembly is a Type II BTX compliant design and is
compliant with the reference BTX motherboard keep-out and height recommendations
defined Section 6.6.
The solution comes as an integrated assembly. An isometric view of the assembly is
provided Figure 5-4.
5.1.1 Target Heatsink Performance
Table 5-1 provides the target heatsink performance for the processor with the BTX
boundary conditions. The results will be evaluated using the test procedure described
in Section
5.2.
The table also includes a T
A
assumption of 35.5 °C for the Intel reference thermal
solution at the processor fan heatsink inlet discussed Section
3.3. The analysis
assumes a uniform external ambient temperature to the chassis of 35 °C across the
fan inlet, resulting in a temperature rise, T
R
, of 0.5 °C. Meeting T
A
and Ψ
CA
targets can
maximize processor performance (refer to Sections
2.2, 2.4. and Chapter 4).
Minimizing T
R
, can lead to improved acoustics.
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