Mechanical Drawings
Thermal and Mechanical Design Guidelines
145
Figure 7-63. Intel
®
E18764-001 Reference Solution Assembly
E18764
E18764-00X
BOXED PROCESSOR FAN HEATSINK
CPG
A
4
B
3
C
D
43
21
A
2
C
1
D
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
DWG. NO.
SH. REV.
FINISH:
MATERIAL:
DESIGNED BY
DRAWN BY
CHECKED BY
APPROVED BY
DATE
DATE
DATE
DATE
DO NOT SCALE DRAWING
SCALE: 1:1
SHEET 1 OF 1
DRAWING NUMBERCAGE CODE
SIZE
C
TITLE
DEPARTMENT
R
REV
5000 W. CHANDLER BLVD.
CHANDLER, ARIZONA 85226
THIRD ANGLE PROJECTION
1
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILIMETERS.
TOLERANCES:
NO DECIMAL PLACES:
ANGLES:
ONE DECIMAL PLACE:
TWO DECIMAL PLACES:
INTERPRET DIM AND TOL PER
ASME Y14.5M-1994.
REVISION HISTORY
ZONE REV. DESCRIPTION DATE APPROVED
FAN TYPE
LINEARLY VARIABLE DC
MASS
250 GRAMS
SOUND LEVEL
HIGH SET POINT: 35 dBA
LOW SET POINT: 25 dBA
MINIMUM SPEED AT LOW PWM - 1000 RPM
46.0
1.81
90.0
3.54
THERMAL INTERFACE MATERIAL
DOW TC-1996 (PRE-APPLIED)
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