Thermal and Mechanical Design Guidelines 5
A.2.1 Heatsink Preload Requirement Limitations...................................75
A.2.2 Motherboard Deflection Metric Definition.....................................76
A.2.3 Board Deflection Limits ............................................................77
A.2.4 Board Deflection Metric Implementation Example.........................78
A.2.5 Additional Considerations .........................................................79
A.3 Heatsink Selection Guidelines.................................................................80
Appendix B Heatsink Clip Load Metrology............................................................................81
B.1 Overview ............................................................................................81
B.2 Test Preparation...................................................................................81
B.2.1 Heatsink Preparation................................................................81
B.2.2 Typical Test Equipment ............................................................84
B.3 Test Procedure Examples.......................................................................84
B.3.1 Time-Zero, Room Temperature Preload Measurement...................85
B.3.2 Preload Degradation under Bake Conditions ................................85
Appendix C Thermal Interface Management.........................................................................87
C.1 Bond Line Management.........................................................................87
C.2 Interface Material Area..........................................................................87
C.3 Interface Material Performance...............................................................87
Appendix D Case Temperature Reference Metrology..............................................................89
D.1 Objective and Scope.............................................................................89
D.2 Supporting Test Equipment....................................................................89
D.3 Thermal Calibration and Controls............................................................91
D.4 IHS Groove .........................................................................................91
D.5 Thermocouple Attach Procedure .............................................................95
D.5.1 Thermocouple Conditioning and Preparation................................95
D.5.2 Thermocouple Attachment to the IHS.........................................96
D.5.3 Solder Process......................................................................101
D.5.4 Cleaning and Completion of Thermocouple Installation................105
D.6 Thermocouple Wire Management..........................................................108
Appendix E Legacy Fan Speed Control..............................................................................109
E.1 Thermal Solution Design .....................................................................109
E.1.1 Determine Thermistor Set Points .............................................109
E.1.2 Minimum Fan Speed Set Point................................................. 110
E.2 Board and System Implementation .......................................................111
E.2.1 Choosing Fan Speed Control Settings.......................................111
E.3 Combining Thermistor and On-Die Thermal Sensor Control.......................115
E.4 Interaction of Thermal Profile and T
CONTROL
.............................................115
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations..................121
Appendix G Fan Performance for Reference Design.............................................................125
Appendix H Mechanical Drawings.....................................................................................128
Appendix I Intel Enabled Reference Solution Information....................................................146
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