Feature Description
• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)
• SRAM (Hardware support only)
Note: For 600 Mbps performance, –6 device speed grade is required.
Performance varies according to device grade (commercial, industrial, or
automotive) and device speed grade (–6 or –7). Refer to the MAX 10
Device Data Sheet or External Memory Interface Spec Estimator for more
details.
Configuration • Internal configuration
• JTAG
• Advanced Encryption Standard (AES) 128-bit encryption and compression
options
• Flash memory data retention of 20 years at 85 °C
Flexible power supply schemes • Single- and dual-supply device options
• Dynamically controlled input buffer power down
• Sleep mode for dynamic power reduction
1.3 MAX 10 Device Ordering Information
Figure 1. Sample Ordering Code and Available Options for MAX 10 Devices
V : Wafer-Level Chip Scale (WLCSP)
E : Plastic Enhanced Quad Flat Pack (EQFP)
M : Micro FineLine BGA (MBGA)
U : Ultra FineLine BGA (UBGA)
F : FineLine BGA (FBGA)
Family Signature
Package Type
WLCSP Package Type
36 : 36 pins, 3 mm x 3 mm
81 : 81 pins, 4 mm x 4 mm
EQFP Package Type
144 : 144 pins, 22 mm x 22 mm
UBGA Package Type
169 : 169 pins, 11 mm x 11 mm
324 : 324 pins, 15 mm x 15 mm
FBGA Package Type
256 : 256 pins, 17 mm x 17 mm
484 : 484 pins, 23 mm x 23 mm
672 : 672 pins, 27 mm x 27 mm
MBGA Package Type
153 : 153 pins, 8 mm x 8 mm
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
6 (fastest)
7
8
10M 16 DA U 484 I 7 G
SC : Single supply - compact features
:
:
:
:
SA : Single supply - analog and flash features
with RSU option
DC
Dual supply - compact features
DF
Dual supply - flash features with RSU option
DA
Dual supply - analog and flash features
with RSU option
Feature Options
02 : 2K logic elements
04 : 4K logic elements
08 : 8K logic elements
16 : 16K logic elements
25 : 25K logic elements
40 : 40K logic elements
50 : 50K logic elements
Member Code
10M : MAX 10
G : RoHS6
ES : Engineering sample
P : Leaded package
C : Commercial (T = 0° C to 85° C)
I : Industrial (T = - 40° C to 100° C)
A : Automotive (T = - 40° C to 125° C)
J
J
J
Note: The –I6 and –A6 speed grades of the MAX 10 FPGA devices are not available by
default in the Quartus Prime software. Contact your local Intel sales representatives
for support.
Related Links
Intel FPGA Product Selector
Provides the latest information about Intel FPGAs.
1 MAX
®
10 FPGA Device Overview
MAX 10 FPGA Device Overview
5