Lenovo ThinkServer RD650 User Guide And Hardware Maintenance Manual

•Ifyourserverhasairductsorairbaffles,donotremovethemwhiletheserverisrunning.Operatingthe
serverwithouttheairductsorairbafflesmightcausethemicroprocessor(s)tooverheat.
•Forserversthatsupportuptotwomicroprocessors,ensurethatthesecondmicroprocessorsocket
alwayscontainsamicroprocessororisprotectedbyamicroprocessorsocketcover.
Workinginsidetheserverwiththepoweron
Attention:Staticelectricitythatisreleasedtointernalservercomponentswhentheserveristurnedonmightcause
theservertohalt,whichmightresultinthelossofdata.Toavoidthispotentialproblem,alwaysuseanESDwriststrap
orothergroundingsystemwhenyouworkinsidetheserverwiththepoweron.
Theserversupportshot-swapdevicesandisdesignedtooperatesafelywhileitisturnedonandthecoveris
removed.Followtheseguidelineswhenyouworkinsidetheserverwiththepoweron:
•Avoidwearingloose-fittingclothingonyourforearms.Buttonlong-sleevedshirtsbeforeworkinginside
theserver;donotwearcufflinkswhileyouareworkinginsidetheserver.
•Donotallowyournecktieorscarftohanginsidetheserver.
•Removejewelry,suchasbracelets,necklaces,rings,andloose-fittingwristwatches.
•Removeitemsfromyourshirtpocket,suchaspensandpencils.Theseitemsmightfallintotheserveras
youleanoverit.
•Avoiddroppinganymetallicobjectsintotheserver,suchaspaperclips,hairpins,andscrews.
Removingorextendingtheserverfromtherackcabinet
Iftheserverisinstalledinarackcabinet,removeorextendtheserverfromtherackcabinetbeforeinstalling
orreplacinghardware.Dependingontherailtype,dooneofthefollowing:
•Iftheserverisinstalledinarackcabinetusingstaticrails,removetheserverfromtherackcabinetand
placeitonaflat,clean,andstatic-protectivesurface.SeetheRackInstallationInstructionsthatcomes
withtheserver.
•Iftheserverisinstalledinarackcabinetusingsliderails,presstherackhandlestoextendtheserverfrom
therackcabinet.However,iftheworkingenvironment,cablingconfiguration,ortheserverlocationin
therackcabinetcreatesawkwardconditions,removetheserverfromtherackcabinet.SeetheRack
InstallationInstructionsthatcomeswiththeserver.
Removingtheservercover
Attention:Donotopenyourserverorattemptanyrepairbeforereadingandunderstanding“Readthisfirst:safety
information”onpagev
and“Guidelines”onpage73.
Beforeyoubegin,printalltherelatedinstructionsorensurethatyoucanviewthePDFversiononanother
computerforreference.
Note:Dependingonthemodel,yourservermightlookdifferentfromtheillustrationsinthistopic.
Toremovetheservercover,dothefollowing:
1.Removeallexternalmediafromthedrives.Then,turnoffallattacheddevicesandtheserver.
2.Disconnectallpowercordsfromelectricaloutlets.
3.Disconnectthepowercords,Input/Output(I/O)cables,andallothercablesthatareconnectedto
theserver.
4.Prepareyourserver.See“Removingorextendingtheserverfromtherackcabinet”onpage75.
Chapter6.Replacinghardware75

Lenovo ThinkServer RD650 Specifications

General

HDD size	2.5 \
RAID support	Yes
HDD interface	Serial ATA III
Optical drive type	DVD±RW
Total storage capacity	600 GB
Maximum storage capacity	74 TB
Number of HDDs installed	2
Memory slots	24
Internal memory	16 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	768 GB
Flash memory	2048 MB
PCI Express slots version	3.0
PCI Express x8 (Gen 3.x) slots	8
Operating system installed	No
Compatible operating systems	Microsoft Windows Server 2012 R2 (Including Hyper-V), Microsoft Windows Server 2012 (Including Hyper-V), Microsoft Windows Server 2008 R2 SP1 (Including Hyper-V), SUSE Linux Enterprise Server, Red Hat Enterprise Linux Server, VMware vSphere ESXi
Chassis type	Rack (2U)
Power supply	750 W
Number of redundant power supplies installed	1
Number of 3.5\" bays	0
Processor ARK ID	83352
Intel Secure Key Technology version	1.00
Intel Identity Protection Technology version	0.00
Tcase	72.6 °C
Bus type	QPI
Stepping	R2
Scalability	2S
Processor code	SR207
Processor cache	15 MB
Processor cores	6
Processor model	E5-2620V3
System bus rate	8 GT/s
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Processor threads	12
Processor codename	Haswell
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Configurable TDP-down	85 W
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	52.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
PCI Express configurations	x4, x8, x16
Supported instruction sets	AVX
Maximum number of PCI Express lanes	40
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	1600, 1866 MHz
Memory bandwidth supported by processor (max)	59 GB/s
Storage temperature (T-T)	-10 - 60 °C
Operating temperature (T-T)	5 - 45 °C
USB 2.0 ports quantity	4
On-board graphics card model	Not available

Weight and Dimensions

Depth	762 mm
Width	482.6 mm
Height	87 mm
Weight	15875.73 g