EasyManua.ls Logo

Lenze ECSEE040 - Mounting in Cold−Plate Design

Lenze ECSEE040
169 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
Mechanical installation
Mounting in cold−plate design
4
30
EDBCSXE040 EN 6.0
4.4 Mounting in cold−plate design
The ECSCE series power supply modules are intended for mounting in cold plate technique
(e.g. on collective coolers).
Requirements for collective coolers
The following requirements must be met to ensure safe and reliable operation of the
power supply modules:
ƒ Good thermal contact with the cooler:
The contact surface between collective cooler and power supply module must be
at least as large as the cooling plate of the power supply module.
Smooth contact surface, max. deviation 0.05 mm.
Use all prescribed screwed connections to connect the collective cooler to the
power supply module.
ƒ Comply with the thermal resistance R
th
according to the table.
The values are valid for operation of the power supply modules under rated
conditions.
Power supply
module
Power to be dissipated Heatsink ˘ environment
Type Ploss [W] R
th
[k/W]
ECSCE012 30.0 0.45
ECSCE020 45.0 0.34
ECSCE040 81.0 0.17
ƒ Ambient conditions:
The rated data regarding the ambient temperature remain valid for the power
supply modules ( 19 ff.).
Temperature of the cooling plate ("cold plate"): max. +85 °C

Table of Contents

Related product manuals