Motorola i897 - Page 14

1.8 Receiver Path Section................................................................................................................... 42
1.8.1 JANUS Module (RXPath)......................................................................................................................43
1.8.2 Sledgehammer IC (RXPath)...................................................................................................................43
1.8.3 Roadrunner IC (RX Path).......................................................................................................................43
1.9 Frequency Generator (RF) Section............................................................................................. 44
1.10 Global Positioning System (GPS) Section............................................................................... 45
1.10.1 GPS Receiver .........................................................................................................................................45
1.10.2 GPS Antenna..........................................................................................................................................46
1.10.3 JANUS IC...............................................................................................................................................46
1.10.4 GPS Receiver .........................................................................................................................................46
1.10.5 GPS Receiver .........................................................................................................................................46
1.10.6 GPS Receiver .........................................................................................................................................46
1.10.7 GPS Receiver .........................................................................................................................................46
1.10.8 GPS Receiver .........................................................................................................................................46
1.11 Bluetooth® Wireless System .................................................................................................... 47
Chapter 2 ...................................................................................................49
PREPARING FOR FIELD LEVEL TESTING ..............................................49
2.1 Preparing Equipment for Testing ............................................................................................... 49
2.1.1 Calibrating Equipment............................................................................................................................49
2.1.2 Checking the RF Cable...........................................................................................................................49
2.1.3 Strong-Signal Environments...................................................................................................................49
2.1.4 Protecting Static-Sensitive Devices........................................................................................................49
2.2 Using RSS...................................................................................................................................... 50
2.3 Connecting an i897 Unit to the R-2660....................................................................................... 50
2.4 Operating the R-2660 ................................................................................................................... 51
2.5 Dis-Assembly and Assembly of i897 Unit................................................................................... 52
2.6 Disassembly Procedure ................................................................................................................ 52
2.6.1 Disassembly Sequence Pane chart..........................................................................................................52
2.6.2 Battery Cover and Battery Removal.......................................................................................................53
2.6.3 SIM Card and SD Card Removal ...........................................................................................................54
2.6.4 Back Housing Removal..........................................................................................................................55
2.6.5 Main Board Removal .............................................................................................................................56
2.6.6 Flip Assembly Access ............................................................................................................................57
2.7 Assembly Procedure..................................................................................................................... 59
2.7.1 Assembly Sequence Pane Chart .............................................................................................................59
2.7.2 Main Board Preparation .........................................................................................................................60
2.7.3 Flip to Front Housing Assembly ............................................................................................................62
2.7.4 Main Board Assembly............................................................................................................................65
2.7.5 Back Housing Assembly ........................................................................................................................67
2.7.6 Closing the Unit......................................................................................................................................68
2.7.7 SIM Card and SD Card Installation........................................................................................................69
2.7.8 Battery and Battery Door Installation.....................................................................................................70
Chapter 3 ....................................................................................................71
TROUBLESHOOTING .............................................................................71
3.1 Digital Analysis Test..................................................................................................................... 71
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