CONTENTS 
 
SAFETY AND GENERAL INFORMATION............................................v 
MODEL INFORMATION...............................................................................ix 
MODEL SPECIFICATIONS......................................................................x 
PREFACE ...................................................................................................xi 
CONTENTS ................................................................................................xiii 
Chapter 1 ....................................................................................................17 
SYSTEM OVERVIEW ..................................................................................17 
1.1  iDEN Digital Modulation Technology......................................................................................... 17 
1.2  iDEN Voice Compression Technology ........................................................................................ 19 
1.2.1  RF Transmission Bursts......................................................................................................................... 19 
1.2.2  Calling Area Coverage........................................................................................................................... 20 
1.2.3  Service Area........................................................................................................................................... 21 
1.3  Radio Architecture Overview......................................................................................................22 
1.4  Roadrunner Circuitry ..................................................................................................................23 
1.5   Audio Section ............................................................................................................................... 25 
1.5.1  Acoustic Transducers............................................................................................................................. 25 
1.5.2  Audio Amplifiers................................................................................................................................... 25 
1.5.3  Audio Modes.......................................................................................................................................... 27 
1.5.4  Audio Paths............................................................................................................................................ 27 
1.5.5  Transmit Paths ....................................................................................................................................... 28 
1.5.6  Receive Paths......................................................................................................................................... 28 
1.6  Digital Section ...............................................................................................................................28 
1.6.1  Zeus Processor....................................................................................................................................... 29 
1.6.2  MCU Digital Phase Locked Loop (DPLL)............................................................................................ 30 
1.6.3  Host System Clock Synthesizer............................................................................................................. 30 
1.6.4  Host System Clock Synthesizer............................................................................................................. 30 
1.6.5  ZEUS Digital Signal Processor.............................................................................................................. 31 
1.6.6  DSP Phase Locked Loop (PLL)............................................................................................................. 31 
1.6.7  Serial Peripheral Interface (SPI)............................................................................................................ 31 
1.6.8  System Memory..................................................................................................................................... 32 
1.6.9  USB2.0................................................................................................................................................... 32 
1.6.10  Battery ID .............................................................................................................................................. 33 
1.6.11  Keypad Block ........................................................................................................................................ 33 
1.6.12  LCD Circuit ........................................................................................................................................... 34 
1.6.13  CMOS 2.0 Mega-pixel Focus Camera................................................................................................... 34 
1.7  Transmitter Path Section ............................................................................................................. 35 
1.7.1  ROADRUNNER.................................................................................................................................... 36 
1.7.2  Sledgehammer IC (TX Path).................................................................................................................. 37 
1.7.3  JANUS................................................................................................................................................... 37 
1.7.4  Cartesian Feedback................................................................................................................................39 
1.7.5  Level Set and Phase Training................................................................................................................. 40 
 
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